Used for Bevel Edge grinding of Silicon Wafer  
     
     
      Edge grinding wheels for grinding Silicon Wafer and other semiconductor materials,in the most demanded application of high precision.
      Provide high grinding efficiency and maintain long wheels life.
      Eliminate chip breaking during grinding operation
     
    Outer Diameter
    SINGLE GRIT #800(20~30um)
    4"
    6"
    SINGLE GRIT #800(20~20um)
    DUAL GRIT #800(20~30um),#1200(10~20um)
     
    Outer Diameter
    H
    Tn
    T
    GROOVE
    Bond
    4"
    8"
    20
    30
    1.5~2.5
    2.0~2.5
    8~9
    14~16
    1~3
    5~6
    Electroplated
    Metal
     

 
Diamond Dicing Blade | Micro Blades | Silicon Wafer Back Grinding Wheels
MSSL Wheels(Metal Sintered Single Layer) | Diamond Precision Blades

General Tool, Inc., 2025 Alton Parkway, Irvine, CA 92606 | Telephone : 949-261-2322 | Fax : 949-261-2614
Copyright © 1999 General Tool, Inc. All Rights Reserved.